e-CVD: Dry electrodeposition for more sustainable chip production

Research question

This project will explore how a novel type of low temperature chemical vapor deposition (CVD), where free electrons from a plasma are used to deposit a thin layer of metal can be used in the production of electronic chips. Deposition of a metallic layer by CVD require surface redox reactions, typically enabled by high temperatures or very reactive and unstable molecules. Using the electrons in a plasma opens up new low temperature paths.

Sustainability aspects

Thin layers of metals are used to electrically connect all transistors in a chip, and are today deposited by wet-chemical techniques, rendering large quantities of water contaminated by metal ions. The chips must also move between water and vacuum several times, requiring energy and adding complexity. A vacuum-based, low temperature CVD process would simplify the process and reduce consumption of clean water and energy.